Thermal fatigue of solder joints in micro-electronic devices

Thermal fatigue of solder joints in micro-electronic devices

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1986. === MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING === Bibliography: leaves 48-52. === by Pamela Joan Adams. === M.S.

Bibliographic Details
Main Author: Adams, Pamela Joan
Other Authors: Lallit Anand.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2005
Subjects:
Mechanical Engineering.
Online Access:http://hdl.handle.net/1721.1/15070

Internet

http://hdl.handle.net/1721.1/15070

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