Copper wafer bonding in three-dimensional integration
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. === Includes bibliographical references (p. 165-176). === Three-dimensional (3D) integration, in which multiple layers of devices are stacked with high density of interconnects between...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2006
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| Online Access: | http://hdl.handle.net/1721.1/30156 |