Die-level glass frit vacuum packaging for a micro-fuel processor system
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. === Includes bibliographical references (p. 89-90). === Vacuum packaging utilizing glass frit is investigated for the use with a micro-fuel processor. Enhanced device performance through...
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Format: | Others |
Language: | English |
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Massachusetts Institute of Technology
2006
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Online Access: | http://hdl.handle.net/1721.1/34112 |