Die-level glass frit vacuum packaging for a micro-fuel processor system

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005. === Includes bibliographical references (p. 89-90). === Vacuum packaging utilizing glass frit is investigated for the use with a micro-fuel processor. Enhanced device performance through...

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Bibliographic Details
Main Author: Cheung, Kerry
Other Authors: Martin A. Schmidt.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2006
Subjects:
Online Access:http://hdl.handle.net/1721.1/34112