Through-substrate interconnects for 3-D integration and RF systems
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, February 2007. === Includes bibliographical references (p. 123-132). === Interconnects on silicon chips are fabricated on the top surface with an ever-increasing number of metal layers neces...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2007
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| Online Access: | http://hdl.handle.net/1721.1/38922 |