Wettability of low Sn solders on integrated circuit package metallizations

Wettability of low Sn solders on integrated circuit package metallizations

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1983. === MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE === Includes bibliographical references. === by Michelle Wendy Gabriel. === M.S.

Bibliographic Details
Main Author: Gabriel, Michelle Wendy
Other Authors: Nicholas J. Grant.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2008
Subjects:
Materials Science and Engineering.
Online Access:http://hdl.handle.net/1721.1/42094

Internet

http://hdl.handle.net/1721.1/42094

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