Novel approaches to low temperature transient liquid phase bonding in the In-Sn/Cu and In-Sn-Bi/Cu systems
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008. === Vita. === Includes bibliographical references (leaves 112-113). === A fluxless low temperature transient liquid phase (LTTLP) bonding process was studied as a method of producing Cu/Cu joints...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2009
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| Online Access: | http://hdl.handle.net/1721.1/44424 |