Control of wafer-scale non-uniformity in chemical-mechanical planarization by face-up polishing

Control of wafer-scale non-uniformity in chemical-mechanical planarization by face-up polishing

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2008. === Includes bibliographical references (leaves 132-135). === Chemical-mechanical planarization (CMP) is a key process in the manufacture of ultra-large-scale-integrated (ULSI) semiconductor devices. A major...

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Bibliographic Details
Main Author: Mau, Catherine (Catherine K.)
Other Authors: Jung-Hoon Chun and Nannaji Saka.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2009
Subjects:
Mechanical Engineering.
Online Access:http://hdl.handle.net/1721.1/45202

Internet

http://hdl.handle.net/1721.1/45202

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