Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008. === Includes bibliographical references (p. 84-87). === Wafer bonding is a key process and enabling technology for realization of three-dimensional integrated circuits (3DIC) with reduced inter...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2009
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| Online Access: | http://hdl.handle.net/1721.1/45389 |