Packaging and interconnection of a black-lit CCD sensor device
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1997. === Includes bibliographical references (leaf 48). === This paper describes the engineering and development of a process to electrically and mechanically bond a large area, backlit charge-coupled...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2009
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| Online Access: | http://hdl.handle.net/1721.1/46285 |