Advanced materials, process, and designs for silicon photonic integration
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2009. === Includes bibliographical references (p. 229-235). === The copper (Cu) interconnect has become the bottleneck for bandwidth scaling due to its increasing RC time constant with the decreasing...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2009
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| Online Access: | http://hdl.handle.net/1721.1/46678 |