Underfill material selection for flip chip technology
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998. === Includes bibliographical references (leaf 34). === Six underfill materials were examined for the selection of an appropriate underfill material for Digital Equipment Corporation's flip ch...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2010
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| Online Access: | http://hdl.handle.net/1721.1/50454 |