A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding

A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999. === Includes bibliographical references (p. 89-90). === by Chi-Fan Yung. === S.M.

Bibliographic Details
Main Author: Yung, Chi-Fan, 1973-
Other Authors: Martin A. Schmidt.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2013
Subjects:
Electrical Engineering and Computer Science.
Online Access:http://hdl.handle.net/1721.1/80148

Internet

http://hdl.handle.net/1721.1/80148

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