Characterization and modeling of pattern dependencies in copper interconnects for integrated circuits
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2002. === Includes bibliographical references (p. 173-176). === Copper metallization has emerged as the leading interconnect technology for deep sub-micron features, where electroplating and...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/8082 |