Wafer bonding of processed Si CMOS VLSI and GaAs for mixed technology integration
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, Februaru 2002. === Includes bibliographical references (p. 91-94). === The successful bonding of bare thinned Si SOI wafers to bare GaAs wafers in previous research has proven to be an importa...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/8368 |