An improved anisotropic wet etching process for the fabrication of silicon MEMS structures using a single etching mask
Main Authors: | , , , , |
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Language: | en |
Published: |
IEEE
2008
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Online Access: | http://hdl.handle.net/2237/11137 http://ieeexplore.ieee.org/search/freesrchabstract.jsp?arnumber=4443659&isnumber=4443570&punumber=4443569&k2dockey=4443659@ieeecnfs&query=%28anisotropic+%3Cin%3E+metadata%29+%3Cand%3E+%284443570+%3Cin%3E+isnumber%29&pos=0 |