Multiple-orifice uniform-droplet spraying for the production of fine mono-sized solder balls
Although the single-orifice uniform-droplet spay (SO-UDS) process has been extensively studied over the past two decades and commercial adaptations have been realized particularly in electronics packaging, the relatively low productivity of the single-orifice technology has limited the application o...
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Online Access: | http://hdl.handle.net/2047/d20004935 |