Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning
In this study, the interfacial and electrokinetic phenomena of mixtures of isopropyl alcohol (IPA) and deionized (DI) water in relation to semiconductor wafer drying is investigated. The dielectric constant of an IPA solution linearly decreased from 78 to 18 with the addition of IPA to DI water. The...
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| Online Access: | http://hdl.handle.net/2047/d20000926 |