Densification and metallurgical bonding in copper powder compact during ultrasonic powder consolidation
Ultrasonic powder consolidation (UPC) is a novel, low-temperature, rapid powder consolidation process being investigated at the Advanced Materials Processing Laboratory (AMPL), in which a powder compact to be consolidated is pressed under a uniaxial force, heated to a moderately low temperature (nor...
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| Online Access: | http://hdl.handle.net/2047/D20200338 |