Adhesive microlamination protocol for low-temperature microchannel arrays
A new adhesive bonding method is introduced for microlamination architectures, for producing low-temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses and flow features, resulting in approximately 50...
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| Language: | en_US |
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2012
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| Online Access: | http://hdl.handle.net/1957/28339 |