Analysis and modeling of planar microstrip spiral inductors on lossy substrates
The advent of low-cost RFIC's fabricated in Silicon-based technologies has led to the use of monolithic lumped elements which are located on-die. While it is clearly advantageous to have a high degree of integration and thus fewer off chip elements, parasitic losses due to semiconducting substr...
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| Language: | en_US |
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2012
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| Online Access: | http://hdl.handle.net/1957/33613 |