Embedded passives in a multilayer medium
Recent advances in high density low cost RF and microwave three dimensional integration technologies using LTCC(Low Temperature Cofired Ceramics), laminate and other multilayer hybrid and integrated circuits have increased interest in the design of embedded passive components such as inductors, capa...
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| Language: | en_US |
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2012
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| Online Access: | http://hdl.handle.net/1957/33909 |