Boundary-Condition-Independent Reduced-Order Modeling for Thermal Analysis of Complex Electronics Packages

Boundary-Condition-Independent Reduced-Order Modeling for Thermal Analysis of Complex Electronics Packages

Bibliographic Details
Main Author: Raghupathy, Arun Prakash
Language:English
Published: University of Cincinnati / OhioLINK 2009
Subjects:
Engineering
Mathematics
Mechanical Engineering
Boundary condition independent
compact thermal model
multiple heat source
BCI
ROM
SFP
Online Access:http://rave.ohiolink.edu/etdc/view?acc_num=ucin1240536463

Internet

http://rave.ohiolink.edu/etdc/view?acc_num=ucin1240536463

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