Characterization and Prediction of Fracture within Solder Joints and Circuit Boards

Characterization and Prediction of Fracture within Solder Joints and Circuit Boards

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Double cantilever beam (DCB) specimens with distinct intermetallic microstructures and different geometries were fractured under different mode ratios of loading, ψ, to obtain critical strain energy release rate, Jc. The strain energy release rate at crack initiation, Jci, increased with phase angl...

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Bibliographic Details
Main Author: Nadimpalli, Siva
Other Authors: Spelt, Jan K.
Language:en_ca
Published: 2011
Subjects:
Lead-free solder
Mixed-mode fracture
Microstructure
Mode ratio
Critical energy release rate
J-integral
Elastic-plastic finite element analysis
Crack tip opening displacement
Cohesive zone modeling
Pad cratering
Epoxy cracking
Printed circuit board
Chip scale package
Bending
0548
0794
Online Access:http://hdl.handle.net/1807/29822

Internet

http://hdl.handle.net/1807/29822

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