Effects of Cooling Rate on Microhardness and Contact Resistance of Solder Bumps and Effects of Electroless Ni Plating on Wire Bonding of Al Pads
碩士 === 國立交通大學 === 電子研究所 === 81 === The thesis is divided into two parts. In part one, the effects of cooling rate on the microhardness and contact resistance of solder bumps during reflow were investigated. Wettability on a Ti/Ni/Au substra...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/32314229902059842205 |