A Study of Adhesion of Polyimide on Aluminum
碩士 === 國立交通大學 === 材料科學(工程)研究所 === 82 === Adhesion of polyimide (pI) on metal is one of most important factors affecting the realibility of multilayer interconnection structure used in multi-chip module packaging. In this work, the adhesion of PI on alumi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1994
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82912934951508499319 |