Selective Cu-CVD and TiW Diffusion Barrier for Cu Metallization
碩士 === 國立交通大學 === 電子研究所 === 82 === This thesis study consists of two parts: the selective copper chemical vapor deposition (Cu-CVD) and the TiW diffusion barrier study with respect to the Cu metallization system. In the first part, selecti...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1994
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/21101047467151630521 |