The Modification of Cu/Epoxy interface in the Multilayer Printed Circuit Board

The Modification of Cu/Epoxy interface in the Multilayer Printed Circuit Board

碩士 === 元智大學 === 化學工程研究所 === 82 ===

Bibliographic Details
Main Authors: S.M.Hong, 洪崇銘
Other Authors: S.G.Hong
Format: Others
Language:zh-TW
Online Access:http://ndltd.ncl.edu.tw/handle/87709379236190410926

Internet

http://ndltd.ncl.edu.tw/handle/87709379236190410926

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