Investigation on the Preparation and Properties of Pb-Sn Solder Bump Incorporating Electroless Nickel Deposite and Solder Electroplating
碩士 === 國立成功大學 === 材料科學(工程)研究所 === 83 === Solder electroplating process for flip-chip applications was in this study. The aluminum was sputtered on silicon wafer to function as a current conductor for electroplating.Electroless nickel which...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1995
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00213055368772148470 |