Investigation on the Preparation and Properties of MCM Solder Bump Incorporating Electroless Nickel Deposit and Dip Soldering
博士 === 國立成功大學 === 材料科學(工程)研究所 === 83 === The purpose of this research is to investigate the suitable conditions for preparing solder bumps on aluminum pads with dipping soldering. The properties to be discussed incorporate interdiffusion and reaction betw...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1995
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56451988154341481752 |