Vibration Analysis of Multi-layer Structures in Electronic Packaging

碩士 === 國立清華大學 === 動力機械學系 === 83 ===

Bibliographic Details
Main Authors: Wang, Shao Hua, 汪紹華
Other Authors: Wang Wei Chung
Format: Others
Language:zh-TW
Published: 1995
Online Access:http://ndltd.ncl.edu.tw/handle/39669043405174037755