Thermal Strain Analysis of Electronic Package by Moire'' Interferometry
碩士 === 國立成功大學 === 工程科學系 === 84 ===
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04095950502655766819 |