Thermal Strain Analysis of Electronic Package by Moire'' Interferometry

• Main Authors: Yan, Chin-Jer, 顏群哲
• Other Authors: Ming-Jer Huang
• Format: Others
• Language: zh-TW
• Published: 1996
• Online Access: http://ndltd.ncl.edu.tw/handle/04095950502655766819

碩士 === 國立成功大學 === 工程科學系 === 84 ===