Thermal Strain Analysis of Electronic Package by Moire'' Interferometry

Thermal Strain Analysis of Electronic Package by Moire'' Interferometry

碩士 === 國立成功大學 === 工程科學系 === 84 ===

Bibliographic Details
Main Authors:	Yan, Chin-Jer, 顏群哲
Other Authors:	Ming-Jer Huang
Format:	Others
Language:	zh-TW
Published:	1996
Online Access:	http://ndltd.ncl.edu.tw/handle/04095950502655766819

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