The influence of copper on the deposition structure and electrochemical behavior of electroless nickel alloys
碩士 === 國立成功大學 === 材料科學(工程)學系 === 84 === ABSTRACT The influence of copper ion on deposition structure of the electroless Ni-P alloys was investigated. The electrochemical behavior of the electroless Ni-P and Ni-Cu-P alloys in 3.5 wt% NaCl s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43063581409820839164 |