The influence of copper on the deposition structure and electrochemical behavior of electroless nickel alloys

• Main Authors: Chu, Ming-Chi, 褚明治
• Other Authors: Ju-Tong Lee
• Format: Others
• Language: zh-TW
• Published: 1996
• Online Access: http://ndltd.ncl.edu.tw/handle/43063581409820839164

碩士 === 國立成功大學 === 材料科學(工程)學系 === 84 === ABSTRACT The influence of copper ion on deposition structure of the electroless Ni-P alloys was investigated. The electrochemical behavior of the electroless Ni-P and Ni-Cu-P alloys in 3.5 wt% NaCl solution and 40 wt% NaOH solution at frictional state was studied. The copper-rich phase was precipitated and dispersed in the Ni-Cu-P layer as adding copper ion in the bath. The concentration of copper and nickel varied in the conjugated form. The results of potentiodynamic polarization curve measurements showed that the friction reduced the corrosion resistance of Ni-P alloys , and the corrosion resistance of low copper content Ni-Cu-P alloys was better than those of high copper content in 3.5 wt% NaCl solution. The anodic current density of low copper content Ni-Cu-P alloys was low than those of high copper content in 40 wt% NaOH solution.