Wetting Behavior and Interfacial Reaction Between In-Sn Solders and Electroless Ni-Cu-P Deposits
碩士 === 國立成功大學 === 材料科學(工程)學系 === 84 === This research is to investigate the wetting behavior and the interfacial reactions between electroless Ni-Cu-P deposits and In-Sn solders. Electro- less Ni-Cu-P deposit was applied as a diffusion barrier betwe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34068645960097107993 |