Study of Relationship between In-Line Inspection and Yield in IC Fabrication

• Main Authors: Huang, Chien-Lung, 黃建隆
• Other Authors: Tong Lee-Ing, Lee Wei-I
• Format: Others
• Language: zh-TW
• Published: 1996
• Online Access: http://ndltd.ncl.edu.tw/handle/32751760555957814746

碩士 === 國立交通大學 === 工業工程研究所 === 84 === In integrated circuit(IC) fabrication, wafer's defect have an important impact on its yield. The wafer inspection machine, such as KLA, is often used for in-line inspection to detect the defects on wafer surface. However, the in-line inspection may not be able to locate all the wafer defects since some of defects are unobservable or uninspectable and some of defects are not fatal defects.In this thesis, we propose a procedure to analyze the relationship beuween defects found in each of the in inspection stations and the wafer's yield. A case study indicates that the number of defects found in two in-line inspection stations are significantly related to the wafer yield. For other inspection stations, only little relationships are found between the number of defects and the yield of a wafer. The manufacturer may consider to remove some of these unnecessary inspection stations to increase production speed and reduce the cost.Key Word: integrated circuit, defect, in-line inspection, yield