Study of Relationship between In-Line Inspection and Yield in IC Fabrication
碩士 === 國立交通大學 === 工業工程研究所 === 84 === In integrated circuit(IC) fabrication, wafer's defect have an important impact on its yield. The wafer inspection machine, such as KLA, is often used for in-line inspection to detect the defects on...
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ndltd-TW-084NCTU00300172016-02-05T04:16:33Z http://ndltd.ncl.edu.tw/handle/32751760555957814746 Study of Relationship between In-Line Inspection and Yield in IC Fabrication 積體電路生產線上各檢驗站缺陷數與產品良率關聯性之研究 Huang, Chien-Lung 黃建隆 碩士 國立交通大學 工業工程研究所 84 In integrated circuit(IC) fabrication, wafer's defect have an important impact on its yield. The wafer inspection machine, such as KLA, is often used for in-line inspection to detect the defects on wafer surface. However, the in-line inspection may not be able to locate all the wafer defects since some of defects are unobservable or uninspectable and some of defects are not fatal defects.In this thesis, we propose a procedure to analyze the relationship beuween defects found in each of the in inspection stations and the wafer's yield. A case study indicates that the number of defects found in two in-line inspection stations are significantly related to the wafer yield. For other inspection stations, only little relationships are found between the number of defects and the yield of a wafer. The manufacturer may consider to remove some of these unnecessary inspection stations to increase production speed and reduce the cost.Key Word: integrated circuit, defect, in-line inspection, yield Tong Lee-Ing, Lee Wei-I 唐麗英, 李威儀 1996 學位論文 ; thesis 33 zh-TW |
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碩士 === 國立交通大學 === 工業工程研究所 === 84 === In integrated circuit(IC) fabrication, wafer's defect have an
important impact on its yield. The wafer inspection machine,
such as KLA, is often used for in-line inspection to detect the
defects on wafer surface. However, the in-line inspection may
not be able to locate all the wafer defects since some of
defects are unobservable or uninspectable and some of defects
are not fatal defects.In this thesis, we propose a procedure to
analyze the relationship beuween defects found in each of the in
inspection stations and the wafer's yield. A case study
indicates that the number of defects found in two in-line
inspection stations are significantly related to the wafer
yield. For other inspection stations, only little relationships
are found between the number of defects and the yield of a
wafer. The manufacturer may consider to remove some of these
unnecessary inspection stations to increase production speed and
reduce the cost.Key Word: integrated circuit, defect, in-line
inspection, yield
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author2 |
Tong Lee-Ing, Lee Wei-I |
author_facet |
Tong Lee-Ing, Lee Wei-I Huang, Chien-Lung 黃建隆 |
author |
Huang, Chien-Lung 黃建隆 |
spellingShingle |
Huang, Chien-Lung 黃建隆 Study of Relationship between In-Line Inspection and Yield in IC Fabrication |
author_sort |
Huang, Chien-Lung |
title |
Study of Relationship between In-Line Inspection and Yield in IC Fabrication |
title_short |
Study of Relationship between In-Line Inspection and Yield in IC Fabrication |
title_full |
Study of Relationship between In-Line Inspection and Yield in IC Fabrication |
title_fullStr |
Study of Relationship between In-Line Inspection and Yield in IC Fabrication |
title_full_unstemmed |
Study of Relationship between In-Line Inspection and Yield in IC Fabrication |
title_sort |
study of relationship between in-line inspection and yield in ic fabrication |
publishDate |
1996 |
url |
http://ndltd.ncl.edu.tw/handle/32751760555957814746 |
work_keys_str_mv |
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