A Study of Fast, Wafer Level Electromigration Test Methodology on AlSiCu Metal System
碩士 === 國立交通大學 === 材料科學與工程研究所 === 84 === Conventional electromigration test is very time-consuming, so SWEAT and other fast methods are proposed. However, the extremely large current densities and high temperatures used to achieve acc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93424343415153524731 |