Study of Semiconductor Laser Package by Using Laser Welding Technology
碩士 === 國立中山大學 === 光電(科學)研究所 === 84 === In this thesis, semiconductor laser packaging using auto- matical laser welding technique is investigated. The joining method for packaging of semiconductor lasers by the laser welding technique can offer a number of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07173627082276795702 |