Copper Film by Novel Electroless Deposition
碩士 === 國立中山大學 === 電機工程研究所 === 84 === The advantages of low resistivity and high electromigration have focused attention on copper for the metallization of future integrated circuits. We develop a novel electroless copper deposition which ba...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33795761738681772399 |