The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection

碩士 === 國立清華大學 === 工業工程研究所 === 84 === In the semiconductor industry,manual inspection is less reliable due to the parts are becoming smaller and smaller. Thus, it is necessary use machine vision to replace the manual inspection.Automatic inspection has gai...

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Bibliographic Details
Main Authors: Jung Lien Chen, 陳嶸列
Other Authors: Mao Jiun Wang
Format: Others
Language:en_US
Published: 1996
Online Access:http://ndltd.ncl.edu.tw/handle/86483838861372381469