The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection

• Main Authors: Jung Lien Chen, 陳嶸列
• Other Authors: Mao Jiun Wang
• Format: Others
• Language: en_US
• Published: 1996
• Online Access: http://ndltd.ncl.edu.tw/handle/86483838861372381469

碩士 === 國立清華大學 === 工業工程研究所 === 84 === In the semiconductor industry,manual inspection is less reliable due to the parts are becoming smaller and smaller. Thus, it is necessary use machine vision to replace the manual inspection.Automatic inspection has gained gradual emphasis in the semiconductor industry. An automated inspection system of wafer surface defects has developed in this study.This system can inspect three main defects,which are the darker defects,the lighter defects in the regular region and the defects on the pads.The experimental result shows that the recognition rate for the darker defects in the regular regon is 96.25%.The recognition rate for lighter defects in the regular region is 98.75%.The recognition rate for the defects on the pads is 94.44%.However,the inspection time is a bit too long. Suggestions about approachs to improve the speed of inspection are proposed.