The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection
碩士 === 國立清華大學 === 工業工程研究所 === 84 === In the semiconductor industry,manual inspection is less reliable due to the parts are becoming smaller and smaller. Thus, it is necessary use machine vision to replace the manual inspection.Automatic inspection has gai...
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ndltd-TW-084NTHU00300102015-10-13T14:34:59Z http://ndltd.ncl.edu.tw/handle/86483838861372381469 The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection 應用灰階值強度的方法於晶圓表面自動化檢驗 Jung Lien Chen 陳嶸列 碩士 國立清華大學 工業工程研究所 84 In the semiconductor industry,manual inspection is less reliable due to the parts are becoming smaller and smaller. Thus, it is necessary use machine vision to replace the manual inspection.Automatic inspection has gained gradual emphasis in the semiconductor industry. An automated inspection system of wafer surface defects has developed in this study.This system can inspect three main defects,which are the darker defects,the lighter defects in the regular region and the defects on the pads.The experimental result shows that the recognition rate for the darker defects in the regular regon is 96.25%.The recognition rate for lighter defects in the regular region is 98.75%.The recognition rate for the defects on the pads is 94.44%.However,the inspection time is a bit too long. Suggestions about approachs to improve the speed of inspection are proposed. Mao Jiun Wang 王茂駿 1996 學位論文 ; thesis 63 en_US |
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碩士 === 國立清華大學 === 工業工程研究所 === 84 === In the semiconductor industry,manual inspection is less
reliable due to the parts are becoming smaller and smaller.
Thus, it is necessary use machine vision to replace the manual
inspection.Automatic inspection has gained gradual emphasis in
the semiconductor industry. An automated inspection system of
wafer surface defects has developed in this study.This system
can inspect three main defects,which are the darker defects,the
lighter defects in the regular region and the defects on the
pads.The experimental result shows that the recognition rate
for the darker defects in the regular regon is 96.25%.The
recognition rate for lighter defects in the regular region is
98.75%.The recognition rate for the defects on the pads is
94.44%.However,the inspection time is a bit too long.
Suggestions about approachs to improve the speed of inspection
are proposed.
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author2 |
Mao Jiun Wang |
author_facet |
Mao Jiun Wang Jung Lien Chen 陳嶸列 |
author |
Jung Lien Chen 陳嶸列 |
spellingShingle |
Jung Lien Chen 陳嶸列 The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection |
author_sort |
Jung Lien Chen |
title |
The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection |
title_short |
The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection |
title_full |
The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection |
title_fullStr |
The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection |
title_full_unstemmed |
The Development of Gray Level Intensity method in Automatic Wafer Surface Inspection |
title_sort |
development of gray level intensity method in automatic wafer surface inspection |
publishDate |
1996 |
url |
http://ndltd.ncl.edu.tw/handle/86483838861372381469 |
work_keys_str_mv |
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