Investigations of electromigration induced defects of Al-based interconnect
碩士 === 國立清華大學 === 材料科學(工程)研究所 === 84 ===
Main Authors: | Chen, Yi-Liang, 陳怡良 |
---|---|
Other Authors: | Hwang, Jenn-Chang |
Format: | Others |
Language: | zh-TW |
Published: |
1996
|
Online Access: | http://ndltd.ncl.edu.tw/handle/00300945452851018447 |
Similar Items
-
the Reserch of Electromigration of Al-based interconnects
by: Chang, Chai Der, et al.
Published: (1994) -
Electromigration in Gold Interconnects
Published: (2013) -
Electromigration in integrated circuit interconnects
by: Clarke, Peter John
Published: (1993) -
An Investigation into the Characteristics of Electromigration Failure Mechanisms in Copper Interconnects
by: Ming-Hsien, Lin, et al.
Published: (2006) -
Modeling of and experiments characterizing electromigration-induced failures in interconnects
by: Andleigh, Vaibhav K. (Vaibhav Kumar), 1973-
Published: (2005)