Vacuum Brazing Alumina with Copper
碩士 === 國立臺灣科技大學 === 機械工程研究所 === 84 === This investigation deals with titanium phosphorus and/or indium added to Ag-Cu active filler alloy and the examination of their brazing properties for joining Al2O3 ceramics to copper foil TiO 、TiAl、Cu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09776623839383751525 |