Design of the Bonding Head Mechanism of the High Speed Automatic Wire Bonder
碩士 === 國立中正大學 === 機械工程學系 === 85 === In a high speed automatic wire bonder, a bonding head mechanism is an important device that contains a cam, a Z-axis motion device, a bonding wedge,and a wire clamper.The Z-axis motion device driven by the cam movesth...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1997
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35891736429793638916 |