A Study on the Chemomechanical Polishing(CMP) Properties of Marble

碩士 === 國立成功大學 === 資源工程學系 === 85 === ABSTRACT Chemomechanical polishing (CMP) for planarization has become one of the most rapidly growing segments of the semiconductor manufacturing market.Application of CMP for the planarization of interlayer...

Full description

Bibliographic Details
Main Authors: Lin, Chih-Peng, 林志朋
Other Authors: Chia-Yon Chen
Format: Others
Language:zh-TW
Published: 1997
Online Access:http://ndltd.ncl.edu.tw/handle/85961426723126535872