A Study on the Chemomechanical Polishing(CMP) Properties of Marble
碩士 === 國立成功大學 === 資源工程學系 === 85 === ABSTRACT Chemomechanical polishing (CMP) for planarization has become one of the most rapidly growing segments of the semiconductor manufacturing market.Application of CMP for the planarization of interlayer...
Main Authors: | Lin, Chih-Peng, 林志朋 |
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Other Authors: | Chia-Yon Chen |
Format: | Others |
Language: | zh-TW |
Published: |
1997
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Online Access: | http://ndltd.ncl.edu.tw/handle/85961426723126535872 |
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