Experimental and Numerical Analysis of Wire Sweep in IC Packaging
碩士 === 國立成功大學 === 機械工程學系 === 85 === Wire sweep is a critical process defect in the era of miniaturization of IC. This is because with wire sweep wires may contact each other or even be broken and become short circuit. Unfortunately, the physical nature of wire sweep is still not very clear. Thi...
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| Format: | Others |
| Language: | zh-TW |
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1997
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67771167360404794524 |