Application of high temperature deposited Aluminum gate electrode on the fabrication of a-Si TFT

碩士 === 國立交通大學 === 材料科學與工程研究所 === 85 === The electrical performances of hydrogenated amorphous silicon (a-Si:H), thinfilm transistors are affected by the surface roughness of SiNx/a-Si:H. If wecould get a smooth Al film, the SiNx and a-Si:H...

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Bibliographic Details
Main Authors: Chen, Shih-Ming, 陳世明
Other Authors: Ming-Shiann Feng, Ting-Chang Chang
Format: Others
Language:zh-TW
Published: 1997
Online Access:http://ndltd.ncl.edu.tw/handle/33955215316522525437
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Summary:碩士 === 國立交通大學 === 材料科學與工程研究所 === 85 === The electrical performances of hydrogenated amorphous silicon (a-Si:H), thinfilm transistors are affected by the surface roughness of SiNx/a-Si:H. If wecould get a smooth Al film, the SiNx and a-Si:H film would be more flatter.The high deposited temperature of Al film are expected to suppress hillocks formation. The surface roughness are related to Al(111) and it's deposited temperature. On the other hand, a suitable Al2O3/SiNx double layered insulatorsare applied to fabricate TFT. It has been found that the characteristics of a-Si:H TFT device is strong dependent on the morphology of Al film. When deposited temperature of Al film was 300℃, the surface roughness was most smoothest and for the double layered (Al2O3/SiNx) insulators, the MIM structure of anodized Al2O3 show a breakdown fields as high as 8.188 MV/cm and a low leakage current density of 8.35*10^-8 A/cm, As a result.The a-Si:H TFT fabricated on the smoothest Al/SiNx morphology shows the best performances : μ FET=0.71 cm2/V-sec, Ssub=0.32V/decade. For the double layered (Al2O3/SiNx) insulators TFT, has the best performances : μFET =0.78 cm2/V-sec, Ssub=0.28 V/decade.