A Study on Mechanical Properties during Chemical-Mechanical Polishing Process
碩士 === 國立交通大學 === 機械工程研究所 === 85 === Chemical-Mechanical Polishing (CMP) is a widely accepted manufacturing technology for topographical planarization during ultra-large scale integrated circuits (ULSI) process. Achieving high removal rates while maintaining a lowest possible polish nonuniformity...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1997
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64366095313605775058 |